Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package
arXiv:0801.1003
Abstract
Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA).
Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)